fineplacer

Flip chip bonder showing Chip on Glass and Adhesive ACP

Automatic Laser Bar Bonder with FINEPLACER pico ama

Thermosonic Bonding - Flip Chip Bonder ...powered by FINETECH

Laser bar bondng (automatic) on FINEPLACER® femto

Laser Bar Bonding - FINEPLACER® femto - Finetech

C2W and MCM Assembly

Solder paste dispensing (motorized)

Thermosonic Bonding using Gold on Gold Process on FINEPLACER® lambda

Laboratory, R&D and Prototyping Die Bonding on FINEPLACER® lambda

Laser Bar Bonding using Gold Tin Process on FINEPLACER® lambda

Contactless residual solder removal

0201 rework & repair small passives

Package on Package (PoP) rework & repair

01005 rework & repair

QFN soldering rework & repair

BGA Single ball rework

µBGA soldering rework & repair (2x3mm)

Contactless BGA residual solder removal

Residual Solder Removal in Air Atmosphere (_Chocolate Kiss_)

Residual Solder Removal in Nitrogen Atmospere

QFN Rework - Direct Component Printing

BGA Rework: removal using nitrogen

BGA Rework: removal in air atmoshere

BGA Reballing on stand-alone unit

How to reball BGA components

Complete BGA rework cycle including reballing (Rework Station)

Chip Scale Package (CSP) rework on mobile phone board