Nvidia Looks to Accelerate Production With New Packaging Tech

Nvidia Looks to , Accelerate Production , With New Packaging Technology.
Yahoo Finance reports that Nvidia Corp has announced
plans to use Fan-Out Panel Level Packaging (FOPLP)
technology to package its GB200 AI server chips.
The change was reportedly made to address production constraints
on the currently used Chip on Wafer Substrate (CoWoS) packaging
used at the Taiwan Semiconductor Manufacturing Company.
The change was reportedly made to address production constraints
on the currently used Chip on Wafer Substrate (CoWoS) packaging
used at the Taiwan Semiconductor Manufacturing Company.
According to industry experts, FOPLP
could be a viable alternative to CoWoS
amid the increasing demand for AI chips. .
Analysts consider Nvidia the premier accelerated
compute and generative AI supplier, backed
by production plans with Blackwell Chip. .
Over the past year, stock in
Nvidia has gained over 184%. .
On May 29, shares in Nvidia were up
0.89% at $1,149.10 in premarket trading. .
Yahoo Finance reports that a growing
number of packaging companies are
getting ready to offer FOPLP services. .
Yole Group has predicted that
its market share will increase
from 2% in 2022 to 8% by the year 2028.
The gains are expected to primarily
be driven by higher yields and
increasing cost efficiency.
Experts point out that while FOPLPs could reduce cost
and expand capacity, they have weaker technical
specifications compared to the current CoWoS standard